Invention Grant
- Patent Title: Thermally actuated vents for electronic devices
- Patent Title (中): 用于电子设备的热致动通风口
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Application No.: US13931881Application Date: 2013-06-29
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Publication No.: US09261926B2Publication Date: 2016-02-16
- Inventor: Denica N. Larsen , Prosenjit Ghosh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H01L23/473

Abstract:
Thermally actuated vents for electronic devices. An embodiment of an apparatus includes a vent having a first position and a second position, wherein the first position is an open position and the second position is a closed position; a muscle wire, a first end of the muscle wire being coupled with a connection to the vent and a second end of the muscle wire being coupled with an anchor point; and a tension element, a first end of the tension element being coupled with the vent at a connection point. The muscle wire is to apply a force to the vent to move the vent to the open position upon the muscle wire entering a contracted state, and the tension element pulling the vent to the closed position upon the muscle wire entering a relaxed state.
Public/Granted literature
- US20150003008A1 THERMALLY ACTUATED VENTS FOR ELECTRONIC DEVICES Public/Granted day:2015-01-01
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