Invention Grant
- Patent Title: Joining device, joining system and joining method
- Patent Title (中): 加盟设备，加盟系统和加盟方式
-
Application No.: US14281152Application Date: 2014-05-19
-
Publication No.: US09263268B2Publication Date: 2016-02-16
- Inventor: Masahiro Yamamoto , Shintaro Sugihara , Hajime Furuya
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JP2013-106781 20130521
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/18 ; H01L21/68 ; H01L21/67
Abstract:
A joining device for joining substrates with an intermolecular force includes a first holding unit configured to hold a first substrate on a lower surface thereof, a second holding unit installed below the first holding unit and configured to hold a second substrate on an upper surface thereof, and a temperature adjustment mechanism configured to adjust a temperature of the first substrate before the first substrate is held in the first holding unit and a temperature of the second substrate before the second substrate is held in the second holding unit to a predetermined temperature.
Public/Granted literature
- US20140349465A1 JOINING DEVICE, JOINING SYSTEM AND JOINING METHOD Public/Granted day:2014-11-27
Information query
IPC分类:
