发明授权
US09263315B2 LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
有权
LED引线框架或LED基板，半导体器件以及LED引线框架或LED基板的制造方法
- 专利标题： LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
- 专利标题（中）： LED引线框架或LED基板，半导体器件以及LED引线框架或LED基板的制造方法
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申请号： US13578563申请日： 2011-03-30
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公开(公告)号： US09263315B2公开(公告)日： 2016-02-16
- 发明人: Kazunori Oda , Akira Sakamoto , Yoshinori Murata , Kenzaburo Kawai , Koichi Suzuki , Megumi Oishi
- 申请人： Kazunori Oda , Akira Sakamoto , Yoshinori Murata , Kenzaburo Kawai , Koichi Suzuki , Megumi Oishi
- 申请人地址： JP Tokyo
- 专利权人： DAI NIPPON PRINTING CO., LTD.
- 当前专利权人： DAI NIPPON PRINTING CO., LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff PLC
- 优先权： JP2010-78854 20100330; JP2010-162086 20100716; JP2010-167298 20100726
- 国际申请： PCT/JP2011/058042 WO 20110330
- 国际公布： WO2011/122665 WO 20111006
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L21/683 ; H01L33/48 ; H01L33/60 ; H01L23/31 ; H01L23/495 ; H01L23/498 ; H01L23/00 ; H01L33/62
摘要：
An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.
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