Invention Grant
- Patent Title: Flip chip packaging method, and flux head manufacturing method applied to the same
- Patent Title (中): 倒装芯片封装方法和焊剂头制造方法相同
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Application No.: US14108961Application Date: 2013-12-17
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Publication No.: US09263414B2Publication Date: 2016-02-16
- Inventor: Kyeong Min Yeo , Seung Min Ryu , Dae Jung Kim , Ji Ho Uh , Suk Won Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0021093 20130227
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/00 ; H05K3/34 ; B23K1/00 ; B23K1/20
Abstract:
Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.
Public/Granted literature
- US20140242753A1 FLIP CHIP PACKAGING METHOD, AND FLUX HEAD MANUFACTURING METHOD APPLIED TO THE SAME Public/Granted day:2014-08-28
Information query
IPC分类:
