公开(公告)号：US08727502B2

公开(公告)日：2014-05-20

申请号：US13726819

申请日：2012-12-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong Woo Paeng ,  Dae Jung Kim ,  Chi Won Moon

IPC: B41J2/05

CPC classification number: B41J2/14145 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1634

Abstract: An inkjet print head configured to smoothly discharge high viscosity ink includes a nozzle part configured to discharge ink, a supply flow path part configured to define a flow path to supply ink to be discharged from the nozzle part, and a micro pattern part formed at least one portion of the supply flow path part that is configured to reduce of a flow resistance of the ink flowing through the supply flow path part.

Abstract translation: 构造成平滑地排出高粘度油墨的喷墨打印头包括被配置为排出墨的喷嘴部分，供给流路部分，被配置为限定供给从喷嘴部排出的墨的流路，以及至少形成的微图案部 供应流路部分的一部分被配置为减少流过供给流路部分的油墨的流动阻力。

公开(公告)号：US09263414B2

公开(公告)日：2016-02-16

申请号：US14108961

申请日：2013-12-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyeong Min Yeo ,  Seung Min Ryu ,  Dae Jung Kim ,  Ji Ho Uh ,  Suk Won Lee

IPC: H01L21/44 ,  H01L23/00 ,  H05K3/34 ,  B23K1/00 ,  B23K1/20

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K1/203 ,  H01L24/13 ,  H01L24/75 ,  H01L2224/131 ,  H01L2224/7501 ,  H01L2224/81024 ,  H01L2224/81191 ,  H01L2224/81815 ,  H05K3/3489 ,  H05K2203/0108 ,  H01L2924/00014 ,  H01L2924/014

Abstract: Flip chip packaging methods, and flux head manufacturing methods used in the flip chip packaging methods may be provided. In particular, a flip chip packaging method including printing flux on a pad of a printed circuit board (PCB), mounting the die in a flip chip manner on the PCB such that a bump of the die faces the pad of the PCB, and bonding the bump of the die to the pad of the PCB using the flux may be provided.

Abstract translation: 可以提供倒装芯片封装方法和用于倒装芯片封装方法的磁头制造方法。 特别地，一种倒装芯片封装方法，包括在印刷电路板（PCB）的焊盘上印刷焊剂，以倒装芯片方式将裸片安装在PCB上，使得裸片的凸块面对PCB的焊盘， 可以提供使用焊剂将管芯的焊盘凸起到PCB的焊盘。