Invention Grant
- Patent Title: PoP structure with electrically insulating material between packages
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Application No.: US14593317Application Date: 2015-01-09
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Publication No.: US09263426B2Publication Date: 2016-02-16
- Inventor: Jie-Hua Zhao , Yizhang Yang , Jun Zhai , Chih-Ming Chung
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Meyertons, Hood, Kivlin, Kowert & Goetzel, P.C.
- Agent Gareth M. Sampson
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L25/00 ; H01L25/10 ; H01L23/31 ; H01L23/00

Abstract:
A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages.
Public/Granted literature
- US20150118795A1 PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES Public/Granted day:2015-04-30
Information query
IPC分类: