Invention Grant
US09263601B2 Enhanced adhesion of seed layer for solar cell conductive contact
有权
种子层增强了太阳能电池导电接触的附着力
- Patent Title: Enhanced adhesion of seed layer for solar cell conductive contact
- Patent Title (中): 种子层增强了太阳能电池导电接触的附着力
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Application No.: US13723901Application Date: 2012-12-21
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Publication No.: US09263601B2Publication Date: 2016-02-16
- Inventor: Junbo Wu , Michael C. Johnson , Michael Cudzinovic , Joseph Behnke , Xi Zhu , David D. Smith , Richard Sewell Hamilton , Xiuwen Tu , Seung Bum Rim
- Applicant: Junbo Wu , Michael C. Johnson , Michael Cudzinovic , Joseph Behnke , Xi Zhu , David D. Smith , Richard Sewell Hamilton , Xiuwen Tu , Seung Bum Rim
- Applicant Address: US CA San Jose
- Assignee: SunPower Corporation
- Current Assignee: SunPower Corporation
- Current Assignee Address: US CA San Jose
- Agency: Blakely Sokoloff Taylor Zafman LLP
- Main IPC: H01L31/042
- IPC: H01L31/042 ; H01L31/0224 ; H01L31/18 ; H01L31/0216
Abstract:
Enhanced adhesion of seed layers for solar cell conductive contacts and methods of forming solar cell conductive contacts are described. For example, a method of fabricating a solar cell includes forming an adhesion layer above an emitter region of a substrate. A metal seed paste layer is formed on the adhesion layer. The metal seed paste layer and the adhesion layer are annealed to form a conductive layer in contact with the emitter region of the substrate. A conductive contact for the solar cell is formed from the conductive layer.
Public/Granted literature
- US20140174518A1 ENHANCED ADHESION OF SEED LAYER FOR SOLAR CELL CONDUCTIVE CONTACT Public/Granted day:2014-06-26
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