Invention Grant
- Patent Title: Method and structure for receiving a micro device
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Application No.: US14563763Application Date: 2014-12-08
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Publication No.: US09263627B2Publication Date: 2016-02-16
- Inventor: John A. Higginson , Andreas Bibl , Hsin-Hua Hu
- Applicant: LuxVue Technology Corporation
- Applicant Address: US CA Santa Clara
- Assignee: LuxVue Technology Corporation
- Current Assignee: LuxVue Technology Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B23P19/00 ; H01L33/00 ; H01L33/44 ; H01L23/31 ; H01L33/06 ; H01L33/42 ; H01L33/62 ; H01L21/56
Abstract:
A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
Public/Granted literature
- US20150093842A1 METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE Public/Granted day:2015-04-02
Information query
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