Invention Grant
- Patent Title: Electronic device having a passive heat exchange device
- Patent Title (中): 具有被动热交换装置的电子装置
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Application No.: US14006547Application Date: 2011-12-28
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Publication No.: US09268377B2Publication Date: 2016-02-23
- Inventor: Mark MacDonald , Yoshifumi Yoshi Nishi
- Applicant: Mark MacDonald , Yoshifumi Yoshi Nishi
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: KED & Associates LLP
- International Application: PCT/US2011/067514 WO 20111228
- International Announcement: WO2013/100946 WO 20130704
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/20

Abstract:
An electronic device is provided that includes a base having a first side and a second side, and a lid having a first side and a second side. A hinge device may couple to the base and the lid, and may allow the lid to move relative to the base between the closed state and the opened state. A heat exchange device may be adjacent to the hinge device in an area between the base and the lid. The heat exchange device may receive heat from a component in the base.
Public/Granted literature
- US20140009888A1 ELECTRONIC DEVICE HAVING A PASSIVE HEAT EXCHANGE DEVICE Public/Granted day:2014-01-09
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