Invention Grant
US09269492B2 Bone frame, low resistance via coupled metal oxide-metal (MOM) orthogonal finger capacitor
有权
骨架,低电阻通过耦合金属氧化物金属(MOM)正交手指电容
- Patent Title: Bone frame, low resistance via coupled metal oxide-metal (MOM) orthogonal finger capacitor
- Patent Title (中): 骨架,低电阻通过耦合金属氧化物金属(MOM)正交手指电容
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Application No.: US13799079Application Date: 2013-03-13
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Publication No.: US09269492B2Publication Date: 2016-02-23
- Inventor: John J. Zhu , Pr Chidambaram , Lixin Ge , Bin Yang , Jihong Choi
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agent Xiaotun Qiu
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/38 ; H01G4/005 ; H01L49/02 ; H01G4/33 ; H01G4/10

Abstract:
An orthogonal finger capacitor includes a layer having an anode bone frame adjacent a cathode bone frame, the anode bone frame having a first portion extending along an axis and a second portion extending perpendicular to the axis. A set of anode fingers extends from the first portion. A set of cathode fingers extends from the cathode bone frame, interdigitated with the set of anode fingers. An overlaying layer has another anode bone frame having a first portion parallel to the axis and a perpendicular second portion. A via couples the overlaying anode bone frame to the underlying anode bone frame. The via is located where the first portion of the overlaying anode bone frame overlaps the second portion of the underlying anode bone frame or, optionally, where the second portion of the overlying anode bone frame overlaps the first portion of the underlying anode bone frame.
Public/Granted literature
- US20140092523A1 BONE FRAME, LOW RESISTANCE VIA COUPLED METAL OXIDE-METAL (MOM) ORTHOGONAL FINGER CAPACITOR Public/Granted day:2014-04-03
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