Invention Grant
US09269842B2 Wafer scale image sensor package and optical mechanism 有权
晶圆尺度图像传感器封装和光学机构

Wafer scale image sensor package and optical mechanism
Abstract:
There is provided an optical mechanism including a substrate, an image chip, a light source and a securing member. The image chip and the light source are attached to the substrate. The securing member is secured to the substrate and includes a first containing space for accommodating the light source, a second containing space for accommodating the image chip and a blocking region between the first containing space and the second containing space.
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