Invention Grant
- Patent Title: Wafer scale image sensor package and optical mechanism
- Patent Title (中): 晶圆尺度图像传感器封装和光学机构
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Application No.: US13675095Application Date: 2012-11-13
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Publication No.: US09269842B2Publication Date: 2016-02-23
- Inventor: Hui-Hsuan Chen , Tien-Chia Liu
- Applicant: PixArt Imaging Inc.
- Applicant Address: TW Hsin-Chu County
- Assignee: PIXART IMAGING INC
- Current Assignee: PIXART IMAGING INC
- Current Assignee Address: TW Hsin-Chu County
- Agency: Hauptman Ham, LLP
- Priority: TW100144986 20111207; TW101120895 20120611
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L31/0232 ; H01L31/0216

Abstract:
There is provided an optical mechanism including a substrate, an image chip, a light source and a securing member. The image chip and the light source are attached to the substrate. The securing member is secured to the substrate and includes a first containing space for accommodating the light source, a second containing space for accommodating the image chip and a blocking region between the first containing space and the second containing space.
Public/Granted literature
- US20130147001A1 WAFER SCALE IMAGE SENSOR PACKAGE AND OPTICAL MECHANISM Public/Granted day:2013-06-13
Information query
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