Invention Grant
- Patent Title: Power source encapsulation
- Patent Title (中): 电源封装
-
Application No.: US13964657Application Date: 2013-08-12
-
Publication No.: US09269932B2Publication Date: 2016-02-23
- Inventor: Hariklia Deligianni , Dimitri Kanevsky , Nina Sainath , Tara N. Sainath
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Jeff Tang
- Main IPC: H01M2/08
- IPC: H01M2/08 ; H01M2/04 ; H01M2/10 ; H01R13/66

Abstract:
A method comprising the steps of encapsulating a power source including a set of power terminals in a cover and sealing the power source including the set of power terminals within the cover and inserting a set of conductive contacts through the cover to contact the set of power terminals and provide conductive access to the set of power terminals of the power source from outside the cover without allowing exposure of the power source to an environment outside the cover.
Public/Granted literature
- US20140352139A1 POWER SOURCE ENCAPSULATION Public/Granted day:2014-12-04
Information query