Invention Grant
- Patent Title: Polishing head, and chemical-mechanical polishing system for polishing substrate
- Patent Title (中): 抛光头，抛光基板用化学机械抛光系统
-
Application No.: US14058054Application Date: 2013-10-18
-
Publication No.: US09272386B2Publication Date: 2016-03-01
- Inventor: Shich-Chang Suen , Chin-Hsiang Chan , Liang-Guang Chen , Yung-Cheng Lu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: B24B37/30
- IPC: B24B37/30 ; B24D9/08 ; B24B37/005 ; B24B49/10 ; B24B37/04 ; B24B41/06
Abstract:
A polishing head for a chemical-mechanical polishing system includes a carrier head, at least one electromagnetism actuated pressure sector and a membrane. The electromagnetism actuated pressure sector is disposed on the carrier head. The membrane covers the electromagnetism actuated pressure sector.
Public/Granted literature
- US20150111477A1 Polishing Head, Chemical-Mechanical Polishing System, and Method for Polishing Substrate Public/Granted day:2015-04-23
Information query
