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1.发明申请Platen Assembly, Chemical-Mechanical Polisher, and Method for Polishing Substrate 有权压板装配，化学机械抛光机和抛光基板的方法公开(公告)号：US20150133033A1
公开(公告)日：2015-05-14
申请号：US14078999
申请日：2013-11-13
Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
Inventor： Shich-Chang Suen , Chin-Hsiang Chan , Liang-Guang Chen , Yung-Cheng Lu
CPC classification number: B24B37/34 , B24B37/005 , B24B37/105 , B24B37/205 , B24B37/26 , B24B49/105 , B24B49/12
Abstract: A platen assembly includes a platen body, a polishing pad, and a fountain slurry supplier. The platen body has an upper surface. The polishing pad is disposed on the upper surface of the platen body. The fountain slurry supplier is at least partially disposed on the upper surface of the platen body for supplying slurry up onto the polishing pad.
Abstract translation: 压板组件包括压板体，抛光垫和喷泉浆料供应器。 压板本体具有上表面。 抛光垫设置在压板本体的上表面上。 喷泉浆料供应器至少部分地设置在压板主体的上表面上，用于将浆料提供到抛光垫上。
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2.发明授权Platen assembly, chemical-mechanical polisher, and method for polishing substrate 有权压板装配，化学机械抛光机和抛光基板的方法公开(公告)号：US09352443B2
公开(公告)日：2016-05-31
申请号：US14078999
申请日：2013-11-13
Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
Inventor： Shich-Chang Suen , Chin-Hsiang Chan , Liang-Guang Chen , Yung-Cheng Lu
CPC classification number: B24B37/34 , B24B37/005 , B24B37/105 , B24B37/205 , B24B37/26 , B24B49/105 , B24B49/12
Abstract: A platen assembly includes a platen body, a polishing pad, and a fountain slurry supplier. The platen body has an upper surface. The polishing pad is disposed on the upper surface of the platen body. The fountain slurry supplier is at least partially disposed on the upper surface of the platen body for supplying slurry up onto the polishing pad.
Abstract translation: 压板组件包括压板体，抛光垫和喷泉浆料供应器。 压板本体具有上表面。 抛光垫设置在压板本体的上表面上。 喷泉浆料供应器至少部分地设置在压板主体的上表面上，用于将浆料提供到抛光垫上。
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3.发明授权Polishing head, and chemical-mechanical polishing system for polishing substrate 有权抛光头，抛光基板用化学机械抛光系统公开(公告)号：US09272386B2
公开(公告)日：2016-03-01
申请号：US14058054
申请日：2013-10-18
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Shich-Chang Suen , Chin-Hsiang Chan , Liang-Guang Chen , Yung-Cheng Lu
CPC classification number: B24B37/20 , B24B37/005 , B24B37/04 , B24B37/30 , B24B41/06 , B24B49/10 , B24D9/08
Abstract: A polishing head for a chemical-mechanical polishing system includes a carrier head, at least one electromagnetism actuated pressure sector and a membrane. The electromagnetism actuated pressure sector is disposed on the carrier head. The membrane covers the electromagnetism actuated pressure sector.
Abstract translation: 用于化学机械抛光系统的抛光头包括载体头，至少一个电磁致动压力扇区和膜。 电磁致动压力扇区设置在承载头上。 膜覆盖电磁致动压力扇区。
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4.发明申请Polishing Head, Chemical-Mechanical Polishing System, and Method for Polishing Substrate 有权抛光头，化学机械抛光系统和抛光基板的方法公开(公告)号：US20150111477A1
公开(公告)日：2015-04-23
申请号：US14058054
申请日：2013-10-18
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor： Shich-Chang SUEN , Chin-Hsiang Chan , Liang-Guang Chen , Yung-Cheng Lu
IPC: B24D9/08
CPC classification number: B24B37/20 , B24B37/005 , B24B37/04 , B24B37/30 , B24B41/06 , B24B49/10 , B24D9/08
Abstract: A polishing head for a chemical-mechanical polishing system includes a carrier head, at least one electromagnetism actuated pressure sector and a membrane. The electromagnetism actuated pressure sector is disposed on the carrier head. The membrane covers the electromagnetism actuated pressure sector.
Abstract translation: 用于化学机械抛光系统的抛光头包括载体头，至少一个电磁致动压力扇区和膜。 电磁致动压力扇区设置在承载头上。 膜覆盖电磁致动压力扇区。
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