发明授权
- 专利标题： Circuit device and method of manufacturing the same
- 专利标题（中）： 电路装置及其制造方法
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申请号： US13242202申请日： 2011-09-23
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公开(公告)号： US09275930B2公开(公告)日： 2016-03-01
- 发明人: Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
- 申请人： Shigeki Mashimo , Fumio Horiuchi , Kiyoaki Kudo , Akira Sakurai , Yuhki Inagaki
- 申请人地址： US AZ Phoenix
- 专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人地址： US AZ Phoenix
- 优先权： JP2010-213694 20100924
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; H01L23/433 ; H01L21/56 ; H01L23/31 ; H01L23/495 ; H01L25/07 ; H01L23/00
摘要：
In a hybrid integrated circuit device of the present invention, leads are fixedly attached on the upper surface of a circuit board. The lead includes an island portion, a slope portion, and a lead portion. A transistor and a diode are mounted on the upper surface of the island portion. Electrodes provided on the upper surfaces of the transistor and the diode are connected to a bonding portion through a fine metal wire. The bonding portion of the lead is disposed at a higher position than the island portion. Thus, the fine metal wires connected to the bonding portion are separated from each other.
公开/授权文献
- US20120075816A1 CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME 公开/授权日：2012-03-29
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