Nanowire and planar transistors co-integrated on utbox SOI substrate

Invention Grant

US09276073B2 Nanowire and planar transistors co-integrated on utbox SOI substrate 有权

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Patent Title: Nanowire and planar transistors co-integrated on utbox SOI substrate
Application No.: US14266999

Application Date: 2014-05-01
Publication No.: US09276073B2

Publication Date: 2016-03-01
Inventor: Sylvain Barraud , Yves Morand
Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALT , STMICROELECTRONICS (CROLLES 2) SAS
Applicant Address: FR Paris FR Crolles
Assignee: Commissariat a l'énergie atomique et aux énergies alternatives,STMICROELECTRONICS (CROLLES 2) SAS
Current Assignee: Commissariat a l'énergie atomique et aux énergies alternatives,STMICROELECTRONICS (CROLLES 2) SAS
Current Assignee Address: FR Paris FR Crolles
Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
Priority: FR1354045 20130502
Main IPC: H01L21/84
IPC: H01L21/84 ; H01L29/06 ; H01L29/41 ; H01L51/05 ; H01L51/44 ; H01L29/786 ; H01L27/12

Nanowire and planar transistors co-integrated on utbox SOI substrate

Abstract:

Fabrication of a microelectronic device on a semiconductor on insulator type substrate, the device being provided with a transistor of a given type, the channel structure of which is formed from semiconducting bar(s), a dielectric area different from the insulating layer of the substrate being provided to replace the insulating layer, facing the transistor channel structure, specifically for this given type of transistor.

Public/Granted literature

US20140326955A1 PLANAR TRANSISTORS WITH NANOWIRES COINTEGRATED ON A SOI UTBOX SUBSTRATE Public/Granted day:2014-11-06

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/84	.....衬底不是半导体的，例如绝缘体