Invention Grant
- Patent Title: Multi-chip socket
- Patent Title (中): 多芯片插座
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Application No.: US14323614Application Date: 2014-07-03
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Publication No.: US09277678B2Publication Date: 2016-03-01
- Inventor: Kevin B. Leigh , George D. Megason
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Development
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/10 ; H01L23/13 ; H01L23/32 ; H01L23/36 ; H01R12/71 ; H01R43/20 ; H05K3/32
Abstract:
A multi-chip socket including multiple cavities. The multiple cavities include support surfaces. The support surfaces may be disposed at different heights relative to a reference plane. A first thermal interface is to thermally contact a top surface of the first component, and a second thermal interface is to thermally contact a top surface of the second component.
Public/Granted literature
- US20140313686A1 MULTI-CHIP SOCKET Public/Granted day:2014-10-23
Information query
