Invention Grant
US09278568B2 Stamp-face forming apparatus, method of forming a stamp face, and stamp-face forming system
有权
冲压面成型装置,形成印模面的方法和冲压面成型系统
- Patent Title: Stamp-face forming apparatus, method of forming a stamp face, and stamp-face forming system
- Patent Title (中): 冲压面成型装置,形成印模面的方法和冲压面成型系统
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Application No.: US14534052Application Date: 2014-11-05
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Publication No.: US09278568B2Publication Date: 2016-03-08
- Inventor: Hirotaka Yuno
- Applicant: CASIO COMPUTER CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee: CASIO COMPUTER CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz & Volek PC
- Priority: JP2013-229893 20131106
- Main IPC: B41J2/32
- IPC: B41J2/32 ; B41K3/62 ; B41K1/50 ; B41J2/355 ; B41C1/055

Abstract:
A stamp-face forming apparatus is provided for forming a stamp face. The apparatus has a stamp-face forming unit which is provided with plural heating elements disposed so as to face a surface of a stamp face material, and forms the stamp face on the stamp face material, the stamp face material includes porous material which can be non-porous when heated, and the stamp face material is detachably held in a holding body and is at least partially coated with a film. Further, the apparatus has a controlling unit for controlling the stamp-face forming unit such that an amount of heat per unit area to be applied to a part of the film facing at least one edge portion of the stamp face material is larger than an amount of heat per unit area applied to apart of the film facing the other portion of the stamp face material to be non-porous.
Public/Granted literature
- US20150122141A1 STAMP-FACE FORMING APPARATUS, METHOD OF FORMING A STAMP FACE, AND STAMP-FACE FORMING SYSTEM Public/Granted day:2015-05-07
Information query
IPC分类: