Invention Grant
- Patent Title: Semiconductor packages and methods of forming the same
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Application No.: US14613154Application Date: 2015-02-03
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Publication No.: US09281235B2Publication Date: 2016-03-08
- Inventor: Young-lyong Kim , Taehoon Kim , Jongho Lee , Chul-Yong Jang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2011-0071016 20110718; KR10-2012-0029739 20120323
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L25/00 ; H01L23/00 ; H01L25/065 ; H01L23/31
Abstract:
A semiconductor package may include a substrate including a substrate connection terminal, at least one semiconductor chip stacked on the substrate and having a chip connection terminal, a first insulating layer covering at least portions of the substrate and the at least one semiconductor chip, and/or an interconnection penetrating the first insulating layer to connect the substrate connection terminal to the chip connection terminal. A semiconductor package may include stacked semiconductor chips, edge portions of the semiconductor chips constituting a stepped structure, and each of the semiconductor chips including a chip connection terminal; at least one insulating layer covering at least the edge portions of the semiconductor chips; and/or an interconnection penetrating the at least one insulating layer to connect to the chip connection terminal of each of the semiconductor chips.
Public/Granted literature
- US20150155199A1 SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME Public/Granted day:2015-06-04
Information query
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