Invention Grant
US09282637B2 Epoxy resin compound and radiant heat circuit board using the same
有权
环氧树脂复合物和使用其的辐射热电路板
- Patent Title: Epoxy resin compound and radiant heat circuit board using the same
- Patent Title (中): 环氧树脂复合物和使用其的辐射热电路板
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Application No.: US13968812Application Date: 2013-08-16
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Publication No.: US09282637B2Publication Date: 2016-03-08
- Inventor: Sung Jin Yun , Hyuk Soo Lee , In Hee Cho , Jae Man Park , Myeong Jeong Kim , Jong Heum Yoon , Jeung Ook Park , Jong Sik Lee , Gun Young Gil , Thanh Kieu Giang , Jin Hwan Kim
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2012-0089542 20120816
- Main IPC: B32B27/38
- IPC: B32B27/38 ; H05K1/02 ; H05K1/03 ; C08G59/28 ; C08G59/30 ; C08L63/00 ; H05K1/05 ; C08K3/00
Abstract:
There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler.
Public/Granted literature
- US20140048316A1 EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME Public/Granted day:2014-02-20
Information query
