Invention Grant
US09283651B2 Apparatus including electrical lapping guide and methods of using the same 有权
装置包括电研磨引导件及其使用方法

Apparatus including electrical lapping guide and methods of using the same
Abstract:
An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first contact region and a second contact region, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads. A lapping edge comprises an air-bearing plane axis perpendicular to a lapping axis, and a back edge opposite the lapping edge, the back edge comprising a plurality of notches.
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