Invention Grant
- Patent Title: Apparatus including electrical lapping guide and methods of using the same
- Patent Title (中): 装置包括电研磨引导件及其使用方法
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Application No.: US14019903Application Date: 2013-09-06
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Publication No.: US09283651B2Publication Date: 2016-03-15
- Inventor: Yongjun Zhao , David C. Seets , Mark Ostrowski
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee: SEAGATE TECHNOLOGY LLC
- Current Assignee Address: US CA Cupertino
- Agency: Hollingsworth Davis, LLC
- Main IPC: B24B37/10
- IPC: B24B37/10 ; B24B49/10 ; B24B37/013 ; G11B5/31

Abstract:
An electrical lapping guide has a body with a thickness along a wafer axis, the body comprising a layer of conductive material having a resistivity. The conductive material layer comprises a first contact region and a second contact region, the first and second contact regions configured to electrically connect the electrical lapping guide to electrical leads. A lapping edge comprises an air-bearing plane axis perpendicular to a lapping axis, and a back edge opposite the lapping edge, the back edge comprising a plurality of notches.
Public/Granted literature
- US20150072593A1 APPARATUS INCLUDING ELECTRICAL LAPPING GUIDE AND METHODS OF USING THE SAME Public/Granted day:2015-03-12
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