发明授权
- 专利标题： Substrate processing apparatus
- 专利标题（中）： 基板加工装置
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申请号： US11630512申请日： 2006-04-18
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公开(公告)号： US09287158B2公开(公告)日： 2016-03-15
- 发明人: Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
- 申请人： Tamami Takahashi , Mitsuhiko Shirakashi , Kenya Ito , Kazuyuki Inoue , Kenji Yamaguchi , Masaya Seki
- 申请人地址： JP Tokyo
- 专利权人： EBARA CORPORATION
- 当前专利权人： EBARA CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2005-121679 20050419
- 国际申请： PCT/JP2006/308490 WO 20060418
- 国际公布： WO2006/112530 WO 20061026
- 主分类号： B44C1/22
- IPC分类号： B44C1/22 ; C03C15/00 ; C03C25/68 ; H01L21/302 ; H01L21/461 ; H01L21/687 ; B24B9/06 ; B24B49/04 ; H01L21/67
摘要：
A substrate processing apparatus includes first and second polishing units for polishing a peripheral portion of a substrate, a primary cleaning unit for cleaning the substrate, a secondary cleaning and drying unit for drying the substrate cleaned in the primary cleaning unit, and a measurement unit for measuring the peripheral portion of the substrate. The measurement unit includes a mechanism for measurement required for polishing in the first and second polishing units, such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.
公开/授权文献
- US20080200100A1 Substrate Processing Apparatus 公开/授权日：2008-08-21