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    Substrate Processing Apparatus
    1.
    发明申请
    Substrate Processing Apparatus 有权
    基板加工装置

    公开(公告)号：US20080200100A1

    公开(公告)日：2008-08-21

    申请号：US11630512

    申请日：2006-04-18

    申请人： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

    发明人： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

    IPC分类号： B24B9/06 ,  H01L21/304 ,  B24B49/12

    CPC分类号： H01L21/67219 ,  B24B9/065 ,  B24B49/04 ,  H01L21/302 ,  H01L21/461 ,  H01L21/67253 ,  H01L21/68707 ,  H01L21/68728

    摘要： A substrate processing apparatus (1) includes first and second polishing units (70A, 70B) for polishing a peripheral portion of a substrate (W), a primary cleaning unit (100) for cleaning the substrate (W), a secondary cleaning and drying unit (110) for drying the substrate (W) cleaned in the primary cleaning unit (100), and a measurement unit (30) for measuring the peripheral portion of the substrate (W). The measurement unit (30) includes a mechanism for measurement required for polishing in the first and second polishing units (70A and 70B), such as a diameter measurement mechanism, a cross-sectional shape measurement mechanism, or a surface condition measurement mechanism.

    摘要翻译： 一种基板处理装置（1）包括：用于研磨基板周边部分的第一和第二研磨单元（70A，70B）;用于清洗基板（W）的主清洁单元（100），二次清洗 以及用于干燥在主清洗单元（100）中清洁的基板（W）的干燥单元（110），以及用于测量基板（W）的周边部分的测量单元（30）。 测量单元（30）包括用于在第一和第二研磨单元（70A和70B）中抛光所需的测量机构，例如直径测量机构，横截面形状测量机构或表面状态测量机构 。

    SUBSTRATE PROCESSING APPARATUS
    2.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工设备

    公开(公告)号：US20090017733A1

    公开(公告)日：2009-01-15

    申请号：US11629463

    申请日：2006-04-18

    申请人： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

    发明人： Tamami Takahashi ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Kazuyuki Inoue ,  Kenji Yamaguchi ,  Masaya Seki

    IPC分类号： B24B9/00

    CPC分类号： B24B21/16 ,  B24B9/065 ,  H01L21/67046 ,  H01L21/67092 ,  H01L21/67161 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/67766 ,  H01L21/68707 ,  H01L21/68728 ,  H01L21/68792

    摘要： A substrate processing apparatus (1) has a first polishing unit (400A) and a second polishing unit (400B) for polishing a peripheral portion of a substrate. Each of the two polishing units (400A, 400B) includes a bevel polishing device (450A, 450B) for polishing a peripheral portion of a substrate and a notch polishing device (480A, 480B) for polishing a notch of a substrate. The substrate processing apparatus (1) has a maintenance space (7) formed between the two polishing units (400A, 400B). The bevel polishing devices (450A, 450B) in the two polishing units (400A, 400B) face the maintenance space (7) so as to be accessible from the maintenance space (7).

    摘要翻译： 基板处理装置（1）具有用于研磨基板周边部分的第一研磨单元（400A）和第二研磨单元（400B）。 两个抛光单元（400A，400B）中的每一个包括用于抛光基板的周边部分的斜面抛光装置（450A，450B）和用于抛光基板的凹口的凹口抛光装置（480A，480B）。 基板处理装置（1）具有形成在两个研磨单元（400A，400B）之间的维护空间（7）。 两个抛光单元（400A，400B）中的斜面抛光装置（450A，450B）面向维护空间（7），以便从维护空间（7）进入。

    Apparatus and method for cleaning semiconductor substrate
    6.
    发明授权
    Apparatus and method for cleaning semiconductor substrate 有权
    用于清洁半导体衬底的装置和方法

    公开(公告)号：US06543080B1

    公开(公告)日：2003-04-08

    申请号：US09635848

    申请日：2000-08-11

    申请人： Hiroshi Tomita ,  Soichi Nadahara ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Yuki Inoue

    发明人： Hiroshi Tomita ,  Soichi Nadahara ,  Mitsuhiko Shirakashi ,  Kenya Ito ,  Yuki Inoue

    IPC分类号： B08B312

    CPC分类号： B08B3/12

    摘要： A semiconductor substrate cleaning apparatus and method are capable of efficiently removing contamination from both the obverse and reverse sides of a semiconductor substrate. A single cleaning liquid supply nozzle for supplying a cleaning liquid to both the obverse and reverse sides of a semiconductor substrate to be cleaned is placed at a distance from the outer peripheral edge of the substrate. An ultrasonic vibrator applies ultrasonic waves to both the obverse and reverse sides of the substrate. Four driving rollers are disposed in contact with the outer peripheral edge of the substrate. The driving rollers are adapte to rotate while being engaged with the outer peripheral edge of the substrate thereby drivingly rotating the substrate.

    摘要翻译： 半导体衬底清洁装置和方法能够有效地去除半导体衬底的正面和反面两侧的污染物。 将待清洗的半导体衬底的正面和反面两侧的清洗液供给单个清洗液供给喷嘴设置在与衬底的外周边缘一定距离处。 超声波振动器对基板的正反面施加超声波。 四个驱动辊设置成与基板的外周边缘接触。 驱动辊适于旋转，同时与基板的外周边缘接合，从而驱动旋转基板。

    Apparatus for cleaning a substrate such as a semiconductor wafer
    7.
    发明授权
    Apparatus for cleaning a substrate such as a semiconductor wafer 有权
    用于清洁诸如半导体晶片的基板的装置

    公开(公告)号：US06494220B1

    公开(公告)日：2002-12-17

    申请号：US09584091

    申请日：2000-05-31

    申请人： Naoki Matsuda ,  Kenya Ito ,  Mitsuhiko Shirakashi

    发明人： Naoki Matsuda ,  Kenya Ito ,  Mitsuhiko Shirakashi

    IPC分类号： B08B304

    CPC分类号： H01L21/67051 ,  B08B1/04 ,  B08B3/02 ,  Y10S134/902

    摘要： A cleaning apparatus comprises a holder for holding a substrate such as a semiconductor wafer horizontally and rotating the substrate about its central axis, while conducting a cleaning operation of the substrate by supplying a cleaning liquid thereto. The apparatus further comprises a cleaning vessel including a side wall encircling the substrate rotated by the holder to intercept the cleaning liquid supplied to and scattered from the rotating substrate and then finally drain the cleaning liquid. There is provided a vent duct for carrying gas from the inside of the cleaning vessel to the outside of the same. The vent duct includes an inlet provided at substantially the same level as that of the substrate for introducing the gas into the vent duct. The side wall may include an inner surface along which the cleaning liquid scattered from the substrate flows downward in a spiral manner, with the inner surface, being of a construction which impedes the spiral movement of the liquid in a circumferential or peripheral direction.

    摘要翻译： 清洁装置包括用于水平地保持诸如半导体晶片的基板并且使基板围绕其中心轴旋转的保持器，同时通过向其提供清洁液体进行清洁操作。 该装置还包括一个清洁容器，该清洁容器包括围绕由保持器旋转的基板的侧壁，以拦截供应到旋转基板并从旋转基板散射的清洗液体，然后最终排出清洗液体。 设置有用于将气体从清洁容器的内部输送到其外部的通风管道。 排气管道包括与基板基本相同的水平设置的入口，用于将气体引入通风管道。 侧壁可以包括内表面，从衬底散射的清洁液体沿着内表面以螺旋方式向下流动，内表面具有阻止液体在周向或周向上的螺旋运动的结构。

    Cleaning apparatus
    10.
    发明授权
    Cleaning apparatus 有权
    清洁装置

    公开(公告)号：US06308361B1

    公开(公告)日：2001-10-30

    申请号：US09361244

    申请日：1999-07-27

    申请人： Naoki Matsuda ,  Kenya Ito ,  Mitsuhiko Shirakashi

    发明人： Naoki Matsuda ,  Kenya Ito ,  Mitsuhiko Shirakashi

    IPC分类号： B08B104

    CPC分类号： H01L21/67051 ,  B08B1/00 ,  B08B3/024 ,  H01L21/67046

    摘要： A cleaning apparatus is suitable for cleaning workpieces that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The cleaning apparatus has a holding device for holding the substrate and a cleaning unit capable of slidably contacting the surface of the substrate. The cleaning unit has a nozzle for ejecting high-pressure cleaning liquid onto the substrate, and a cleaning member surrounding the nozzle.

    摘要翻译： 清洁装置适用于清洁需要高度清洁度的工件，例如半导体晶片，玻璃基板或液晶显示器。 清洁装置具有用于保持基板的保持装置和能够与基板的表面滑动接触的清洁单元。 清洁单元具有用于将高压清洗液喷射到基板上的喷嘴和围绕喷嘴的清洁部件。