Invention Grant
- Patent Title: Semiconductor device having fin-type field effect transistor and method of manufacturing the same
- Patent Title (中): 具有鳍式场效应晶体管的半导体器件及其制造方法
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Application No.: US14469615Application Date: 2014-08-27
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Publication No.: US09287401B2Publication Date: 2016-03-15
- Inventor: Jae-Hwan Lee , Sangsu Kim , Changjae Yang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2013-0139160 20131115
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L29/78 ; H01L29/66

Abstract:
A field effect transistor includes a fin structure, having a sidewall, protruding from a substrate, and a device isolation structure on the substrate, the device isolation structure defining the sidewall of the fin structure, wherein the fin structure includes a buffer semiconductor pattern disposed on the substrate and a channel pattern disposed on the buffer semiconductor pattern, wherein the buffer semiconductor pattern has a lattice constant different from that of the channel pattern, and wherein the device isolation structure includes a gap-fill insulating layer, and includes an oxidation blocking layer pattern disposed between the buffer semiconductor pattern and the gap-fill insulating layer.
Public/Granted literature
- US20150137263A1 SEMICONDUCTOR DEVICE HAVING FIN-TYPE FIELD EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-05-21
Information query
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