Invention Grant
- Patent Title: Substrate curvature compensation methods and apparatus
- Patent Title (中): 基板曲率补偿方法和装置
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Application No.: US13745723Application Date: 2013-01-18
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Publication No.: US09291638B2Publication Date: 2016-03-22
- Inventor: Raymond Merrill, Jr. , Anthony Flannery, Jr. , Shingo Yoneoka
- Applicant: mCube Inc.
- Applicant Address: US CA San Jose
- Assignee: mCube, Inc.
- Current Assignee: mCube, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: G01P21/00
- IPC: G01P21/00 ; G01P15/125 ; G01P15/08

Abstract:
A method for providing acceleration data with reduced substrate-displacement bias includes receiving in an accelerometer an external acceleration, determining the acceleration data with reduced substrate displacement bias in a compensation portion in response to a first and a second displacement indicators from a MEMS transducer, and, in response to substrate compensation factors from a MEMS compensation portion, outputting the acceleration data with reduced substrate displacement bias, wherein the first displacement indicator and the second displacement indicator are determined by the MEMS transducer relative to a substrate in response to the external acceleration and to a substrate displacement, and wherein the substrate compensation factors are determined by the MEMS compensation portion relative to the substrate in response to the substrate displacement.
Public/Granted literature
- US20130186171A1 SUBSTRATE CURVATURE COMPENSATION METHODS AND APPARATUS Public/Granted day:2013-07-25
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