Invention Grant
- Patent Title: Method for producing a semiconductor
- Patent Title (中): 半导体制造方法
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Application No.: US14011832Application Date: 2013-08-28
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Publication No.: US09293330B2Publication Date: 2016-03-22
- Inventor: Hans-Joachim Schulze , Ingo Muri , Friedrich Kroener , Werner Schustereder
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L21/322
- IPC: H01L21/322 ; H01L29/868 ; H01L21/265 ; H01L21/263 ; H01L21/324 ; H01L21/3063

Abstract:
A method for producing a semiconductor is disclosed, the method having: providing a semiconductor body having a first side and a second side; forming an n-doped zone in the semiconductor body by a first implantation into the semiconductor body via the first side to a first depth location of the semiconductor body; and forming a p-doped zone in the semiconductor body by a second implantation into the semiconductor body via the second side to a second depth location of the semiconductor body, a pn-junction forming between said n-doped zone and said p-doped zone in the semiconductor body.
Public/Granted literature
- US20150064890A1 METHOD FOR PRODUCING A SEMICONDUCTOR Public/Granted day:2015-03-05
Information query
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