Invention Grant
US09293401B2 Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)
有权
用于形成薄型嵌入式晶片级球栅阵列模制激光器封装（EWLP-MLP）的半导体器件和方法
- Patent Title: Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)
- Patent Title (中): 用于形成薄型嵌入式晶片级球栅阵列模制激光器封装（EWLP-MLP）的半导体器件和方法
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Application No.: US13772683Application Date: 2013-02-21
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Publication No.: US09293401B2Publication Date: 2016-03-22
- Inventor: Seung Wook Yoon , Jose A. Caparas , Yaojian Lin , Pandi C. Marimuthu , Kang Chen , Xusheng Bao , Jianmin Fang
- Applicant: STATS ChipPAC, Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC, Ltd.
- Current Assignee: STATS ChipPAC, Ltd.
- Current Assignee Address: SG Singapore
- Agency: Patent Law Group: Atkins and Associates, P.C.
- Agent Robert D. Atkins
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/498 ; H01L21/56 ; H01L23/00 ; H01L23/31
Abstract:
A semiconductor device has a semiconductor die with an encapsulant deposited over and around the semiconductor die. An interconnect structure is formed over a first surface of the encapsulant. An opening is formed from a second surface of the encapsulant to the first surface of the encapsulant to expose a surface of the interconnect structure. A bump is formed recessed within the opening and disposed over the surface of the interconnect structure. A semiconductor package is provided. The semiconductor package is disposed over the second surface of the encapsulant and electrically connected to the bump. A plurality of interconnect structures is formed over the semiconductor package to electrically connect the semiconductor package to the bump. The semiconductor package includes a memory device. The semiconductor device includes a height less than 1 millimeter. The opening includes a tapered sidewall formed by laser direct ablation.
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