Invention Grant
US09293505B2 System and method for black coating of camera cubes at wafer level
有权
在晶圆级别的相机立方体的黑色涂层的系统和方法
- Patent Title: System and method for black coating of camera cubes at wafer level
- Patent Title (中): 在晶圆级别的相机立方体的黑色涂层的系统和方法
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Application No.: US14270281Application Date: 2014-05-05
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Publication No.: US09293505B2Publication Date: 2016-03-22
- Inventor: Edward Nabighian , Yi Qin , Ward Zhang , Alan Martin
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop & Gage LLP
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A method for black coating camera cubes at wafer level includes expanding the gap between individual diced camera cubes of the wafer by stretching tape securing the diced camera cubes. The method includes applying a black coating layer to the stretched camera cubes, laser trimming undesired portions of the black coating layer, and removing the undesired portions of the black coating layer.
Public/Granted literature
- US20150318325A1 System And Method For Black Coating Of Camera Cubes At Wafer Level Public/Granted day:2015-11-05
Information query
IPC分类:
