Invention Grant
- Patent Title: Semiconductor device with an array of lamellas and a micro-electro-mechanical resonator
- Patent Title (中): 具有片状阵列和微机电谐振器的半导体器件
-
Application No.: US13945113Application Date: 2013-07-18
-
Publication No.: US09293529B2Publication Date: 2016-03-22
- Inventor: Thoralf Kautzsch
- Applicant: Infineon Technologies Dresden GmbH
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH
- Current Assignee: Infineon Technologies Dresden GmbH
- Current Assignee Address: DE Dresden
- Agency: Schiff Hardin LLP
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L29/06 ; H01L21/762 ; H03H3/007 ; H03H9/24 ; H03H9/02
Abstract:
A semiconductor device includes a silicon substrate layer with a decoupling region. The decoupling region of the silicon substrate layer comprises an array of lamellas laterally spaced apart from each other by cavities. Each lamella of the array of lamellas comprises at least 20% silicon dioxide.
Public/Granted literature
Information query
IPC分类:
