Invention Grant
- Patent Title: Scalable multi-layer 2D-mesh routers
- Patent Title (中): 可扩展的多层二维网状路由器
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Application No.: US13927523Application Date: 2013-06-26
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Publication No.: US09294419B2Publication Date: 2016-03-22
- Inventor: William C. Hasenplaugh , Tryggve Fossum , Judson S. Leonard
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Law Offices of R. Alan Burnett, P.S.
- Main IPC: H04L12/933
- IPC: H04L12/933 ; H04L12/721 ; H04L12/24 ; H04L12/733

Abstract:
Architectures, apparatus and systems employing scalable multi-layer 2D-mesh routers. A 2D router mesh comprises bi-direction pairs of linked paths coupled between pairs of IO interfaces and configured in a plurality of rows and columns forming a 2D mesh. Router nodes are located at the intersections of the rows and columns, and are configured to forward data units between IO inputs and outputs coupled to the mesh at its edges through use of shortest path routes defined by agents at the IO interfaces. Multiple instances of the 2D meshes may be employed to support bandwidth scaling of the router architecture. One implementation of a multi-layer 2D mesh is built using a standard tile that is tessellated to form a 2D array of standard tiles, with each 2D mesh layer offset and overlaid relative to the other 2D mesh layers. IO interfaces are then coupled to the multi-layer 2D mesh via muxes/demuxes and/or crossbar interconnects.
Public/Granted literature
- US20150003281A1 SCALABLE MULTI-LAYER 2D-MESH ROUTERS Public/Granted day:2015-01-01
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