Invention Grant
- Patent Title: Optical interconnect in high-speed memory systems
- Patent Title (中): 高速存储器系统中的光互连
-
Application No.: US14263321Application Date: 2014-04-28
-
Publication No.: US09299423B2Publication Date: 2016-03-29
- Inventor: Jacob Baker , Brent Keeth
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H04B10/00
- IPC: H04B10/00 ; G11C11/42 ; G06F13/16
Abstract:
A optical link for achieving electrical isolation between a controller and a memory device is disclosed. The optical link increases the noise immunity of electrical interconnections, and allows the memory device to be placed a greater distance from the processor than is conventional without power-consuming I/O buffers.
Public/Granted literature
- US20140281199A1 OPTICAL INTERCONNECT IN HIGH-SPEED MEMORY SYSTEMS Public/Granted day:2014-09-18
Information query
