Invention Grant
- Patent Title: Methods of continuously wet etching a patterned substrate
- Patent Title (中): 连续湿法蚀刻图案化衬底的方法
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Application No.: US14238781Application Date: 2012-09-19
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Publication No.: US09301397B2Publication Date: 2016-03-29
- Inventor: Jeffrey H. Tokie , Joseph W. Woody, V , Thomas M. Lynch , Daniel M. Lentz , Robert S. Davidson , Cristin E. Moran , Lijun Zu
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN Saint Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN Saint Paul
- Agent Yufeng Dong; Douglas B. Little
- International Application: PCT/US2012/055997 WO 20120919
- International Announcement: WO2013/048834 WO 20130404
- Main IPC: H05K3/06
- IPC: H05K3/06 ; C23F1/00 ; C02F1/10 ; C23F1/02 ; C23F1/08 ; C23F1/30 ; C23F1/46
Abstract:
Metalized web substrate is wet etched in a reaction vessel by contacting with oxidizing and metal complexing agent to remove metal from unpatterned region. Following etching, substrate is rinsed, and rinse is at least partly recycled. Concentrations of oxidizing and metal complexing agents in the etchant bath are maintained by delivering replenishment feeds of each. Concentration of metal in the etchant bath is maintained by discharging some of the etchant bath. Replenishment rates of oxidizing and metal complexing agents and etchant removal rate are determined based at least in part on rate that metal etched from the substrate enters the etchant bath.
Public/Granted literature
- US20140231381A1 Methods of Continuously Wet Etching A Patterned Substrate Public/Granted day:2014-08-21
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