发明授权
- 专利标题： Method of treating wiring substrate and wiring substrate manufactured by the same
- 专利标题（中）： 处理布线基板及其制造的布线基板的方法
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申请号： US14256252申请日： 2014-04-18
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公开(公告)号： US09301399B2公开(公告)日： 2016-03-29
- 发明人: Tomoko Suzuki , Norihumi Tashiro , Yukihide Naito , Akari Hitotsugo
- 申请人： Mitsubishi Gas Chemical Company, Inc. , Ryoko Chemical Co., Ltd.
- 申请人地址： JP Chiyoda-Ku JP Chiyoda-ku
- 专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.,RYOKO CHEMICAL CO., LTD.
- 当前专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.,RYOKO CHEMICAL CO., LTD.
- 当前专利权人地址： JP Chiyoda-Ku JP Chiyoda-ku
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2013-090015 20130423
- 主分类号： H05K3/06
- IPC分类号： H05K3/06 ; H05K3/10 ; C23F1/18 ; C23F1/02 ; C23F1/00 ; C23G1/10 ; C23C22/52 ; C23C18/16 ; C09K13/04 ; H01L21/3213 ; H05K3/38
摘要：
A method of treating a wiring substrate according to an embodiment includes, in a semi-additive process: (1) contacting the wiring substrate with a pre-etching treatment liquid composition containing a chloride ion, the wiring substrate containing a seed layer formed of an electroless copper and a wiring pattern formed of an electrolytic copper; and (2) continuously, etching the wiring substrate with an etching liquid composition containing a hydrogen peroxide, a sulfuric acid, a tetrazole, a chloride ion, a copper ion and a water.
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