Invention Grant
- Patent Title: Method of manufacturing substrate having cavity
- Patent Title (中): 制造具有空腔的基板的方法
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Application No.: US14316382Application Date: 2014-06-26
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Publication No.: US09301407B2Publication Date: 2016-03-29
- Inventor: Masashi Miyazaki , Yuichi Sugiyama , Tatsuro Sawatari , Hideki Yokota , Yutaka Hata
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2013-140101 20130703
- Main IPC: B05D5/12
- IPC: B05D5/12 ; H05K3/46 ; H05K3/44 ; B05D3/12 ; H05K3/00 ; H05K3/04 ; H05K3/30 ; H05K3/42 ; H05K3/06 ; H05K1/18

Abstract:
The method of manufacturing a substrate includes: forming a penetrating hole in a base layer; inserting a metal dummy part in the penetrating hole; forming an insulating portion made of synthetic resin to fill a ring-shaped gap between the penetrating hole and the dummy part; forming lower insulating layers, covering the bottom surface of the dummy part, that are made of synthetic resin on the bottom surface of the base layer to be continuous with the insulating portion; forming upper insulating layers, covering the top surface of the dummy part, that are made of synthetic resin on the top surface of the base layer to be continuous with the insulating portion; forming an exposing hole by routing in the upper insulating layers to expose the top surface of the dummy part; and forming a cavity by removing the dummy part exposed through the exposing hole by etching.
Public/Granted literature
- US20150010694A1 METHOD OF MANUFACTURING SUBSTRATE HAVING CAVITY Public/Granted day:2015-01-08
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