Invention Grant
- Patent Title: Guide assembly
- Patent Title (中): 导轨装配
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Application No.: US13786475Application Date: 2013-03-06
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Publication No.: US09302356B2Publication Date: 2016-04-05
- Inventor: Michael D. Katzenberger , Ike C. Schevers , Anthony P. Slade , David L. Fritsche , James A. Hammond, Jr.
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Main IPC: B25H1/00
- IPC: B25H1/00 ; B23P19/04 ; B21J15/10 ; B21J15/14 ; B21J15/50 ; B23B47/28 ; B23B49/02 ; B23P19/06 ; B25B23/00 ; B25B27/18 ; B23P17/00

Abstract:
A guide assembly comprises a frame assembly, a plurality of clamping assemblies, and a head assembly. The clamping assemblies may be mountable to the frame assembly for attaching the frame assembly to a structure. The head assembly may be mountable to the frame assembly and may include a tool coupled to the head assembly. The tool assembly may be axially movable relative to the head assembly to cause the tool to exert a down force on the structure when the frame assembly is attached thereto.
Public/Granted literature
- US20130174397A1 GUIDE ASSEMBLY Public/Granted day:2013-07-11
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