- 专利标题： Acidic gold alloy plating solution
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申请号： US13292776申请日： 2011-11-09
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公开(公告)号： US09303326B2公开(公告)日： 2016-04-05
- 发明人: Yutaka Morii , Masanori Orihashi
- 申请人： Yutaka Morii , Masanori Orihashi
- 专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC
- 代理商 John J. Piskorski
- 优先权： JP2007-151013 20070606
- 主分类号： C25D3/62
- IPC分类号： C25D3/62 ; C25D5/12
摘要：
A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
公开/授权文献
- US20120055802A1 ACIDIC GOLD ALLOY PLATING SOLUTION 公开/授权日：2012-03-08
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