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公开(公告)号：US08357285B2
公开(公告)日：2013-01-22
申请号：US12156839
申请日：2008-06-05
申请人： Yutaka Morii , Masanori Orihashi
发明人： Yutaka Morii , Masanori Orihashi
摘要： A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
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公开(公告)号：US09303326B2
公开(公告)日：2016-04-05
申请号：US13292776
申请日：2011-11-09
申请人： Yutaka Morii , Masanori Orihashi
发明人： Yutaka Morii , Masanori Orihashi
摘要： A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
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公开(公告)号：US20120048740A1
公开(公告)日：2012-03-01
申请号：US13292733
申请日：2011-11-09
申请人： Yutaka MORII , Masanori Orihashi
发明人： Yutaka MORII , Masanori Orihashi
摘要： A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
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公开(公告)号：US20090014335A1
公开(公告)日：2009-01-15
申请号：US12156839
申请日：2008-06-05
申请人： Yutaka Morii , Masanori Orihashi
发明人： Yutaka Morii , Masanori Orihashi
摘要： A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
摘要翻译： 一种金合金电镀液及其电镀方法，其通过使用含有氰化金，钴离子，六亚甲基四胺的金镀液和特定的光泽剂，提供具有高沉积选择性的镀金溶液。
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公开(公告)号：US09297087B2
公开(公告)日：2016-03-29
申请号：US13292733
申请日：2011-11-09
申请人： Yutaka Morii , Masanori Orihashi
发明人： Yutaka Morii , Masanori Orihashi
摘要： A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
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公开(公告)号：US20120055802A1
公开(公告)日：2012-03-08
申请号：US13292776
申请日：2011-11-09
申请人： Yutaka MORII , Masanori Orihashi
发明人： Yutaka MORII , Masanori Orihashi
摘要： A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
摘要翻译： 一种金合金电镀液及其电镀方法，其通过使用含有氰化金，钴离子，六亚甲基四胺的金镀液和特定的光泽剂，提供具有高沉积选择性的镀金溶液。
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7.发明申请Aqueous solution for surface treatment of metal and method for preventing discoloration of metal surface 有权用于表面处理金属的水溶液和防止金属表面变色的方法公开(公告)号：US20070042122A1
公开(公告)日：2007-02-22
申请号：US11507221
申请日：2006-08-21
申请人： Masanori Orihashi
发明人： Masanori Orihashi
CPC分类号： H05K3/3473 , C25D5/48 , H01L23/49582 , H01L2224/16 , H01L2224/81801 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/19041 , H01L2924/19043 , H05K2203/0392 , H05K2203/043
摘要： To provide a solder-plating film which has good solder wettability and with which discoloration and twisting of the tin film after heat treatment are prevented. A method and a solution for surface treating a tin film are disclosed. The aqueous solution contains specific compounds and is brought into contact with a tin-plating film before reflow treatment of the tin film.
摘要翻译： 提供具有良好的焊料润湿性并且防止热处理后的锡膜的变色和扭曲的焊料镀覆膜。 公开了一种用于表面处理锡膜的方法和解决方案。 水溶液含有特定的化合物，并在锡膜回流处理之前与镀锡膜接触。
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公开(公告)号：US08142639B2
公开(公告)日：2012-03-27
申请号：US11894444
申请日：2007-08-21
CPC分类号： C25D3/62
摘要： A hard gold plating solution and plating method which provides a gold plating solution with high deposition selectivity using a gold plating solution containing gold cyanide, cobalt salt, and hexamethylenetetramine.
摘要翻译： 使用含有氰化金，钴盐和六亚甲基四胺的镀金溶液提供具有高沉积选择性的镀金溶液的硬金镀液和电镀方法。
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公开(公告)号：US08277630B2
公开(公告)日：2012-10-02
申请号：US12657096
申请日：2010-01-13
申请人： Masanori Orihashi
发明人： Masanori Orihashi
CPC分类号： C25D3/32
摘要： A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.
摘要翻译： 当电镀部件摩擦在一起时，例如在散装安装期间，用于芯片部件的镀锡溶液和镀锡方法最大限度地减少了锡屑。 这最大限度地减少了芯片组件的粘附。
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公开(公告)号：US20110308960A1
公开(公告)日：2011-12-22
申请号：US12657096
申请日：2010-01-13
申请人： Masanori Orihashi
发明人： Masanori Orihashi
IPC分类号： C25D3/32
CPC分类号： C25D3/32
摘要： A tin plating solution and tin plating method for chip components minimizes tin shavings when plated components are rubbed together such as during bulk mounting. This minimizes sticking of the chip components together.
摘要翻译： 当电镀部件摩擦在一起时，例如在散装安装期间，用于芯片部件的镀锡溶液和镀锡方法最大限度地减少了锡屑。 这最大限度地减少了芯片组件的粘附。
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