A manufacturing method of touch module includes steps of: providing a substrate and disposing a shield layer on the substrate, a section of the substrate where the shield layer is positioned being defined as a non-touch section, a section of the substrate, which is free from the shield layer being defined as a touch section; printing multiple touch electrodes on the touch section and the non-touch section of the substrate by means of printing process; disposing an insulation layer on the touch electrodes of the non-touch section, the insulation layer being formed with multiple electrical connection holes on the touch electrodes; disposing a lead layer with multiple metal leads on the insulation layer to pass through the electrical connection holes to electrically connect with the touch electrodes; and disposing a protection layer on the touch electrodes and the lead layer.