Invention Grant
- Patent Title: Slice formatting and interleaving for interleaved sectors
- Patent Title (中): 交错扇区的切片格式化和交织
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Application No.: US14153154Application Date: 2014-01-13
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Publication No.: US09304910B2Publication Date: 2016-04-05
- Inventor: Qi Zuo , Kuhong Jeong , Shu Li , Xiang Wang , Han Fang , Shaohua Yang
- Applicant: LSI Corporation
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: G06F12/06
- IPC: G06F12/06

Abstract:
A storage system and method for interleaving a plurality of logical sectors in the storage system is disclosed. The method includes: dividing each logical sector into a predetermined number of slices; sequentially indexing the logical sectors, wherein each logical sector is identified by a logical sector index; sequentially indexing the predetermined number of slices in each logical sector, wherein each slice of the predetermined number of slices is identified by a slice index within each logical sector; and interleaving the logical sectors according to a slice interleaving process. The interleaving step further includes: a) identifying a first indexed slice of a first indexed logical sector as an initial slice; and b) identifying a subsequent slice by advancing the slice index to a subsequent index in the slice index sequence and advancing the logical sector index to a subsequent index in the logical sector index sequence.
Public/Granted literature
- US20150161045A1 Slice Formatting and Interleaving for Interleaved Sectors Public/Granted day:2015-06-11
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