Invention Grant
- Patent Title: High density memory structure
- Patent Title (中): 高密度存储器结构
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Application No.: US14068003Application Date: 2013-10-31
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Publication No.: US09305635B2Publication Date: 2016-04-05
- Inventor: Yangsyu Lin , Hsiao Wen Lu , Chiting Cheng , Jonathan Tsung-Yung Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: G11C5/06
- IPC: G11C5/06 ; G11C11/419 ; G11C7/18

Abstract:
A semiconductor memory comprises a plurality of sub banks each including one or more rows of memory bit cells connected to a set of local bit lines, wherein the sub banks share a same set of global bit lines for reading/writing data from/to the memory bit cells of the sub banks. The semiconductor memory chip further comprises a plurality of switch elements for each of the sub banks, wherein each of the switch elements connects the local bit line and the global bit line of a corresponding one of the memory bit cells in the sub bank for data transmission between the local bit line and the global bit line. The semiconductor memory chip further comprises a plurality of bank selection signal lines each connected to the switch elements in a corresponding one of the sub banks, wherein the bank selection signal lines carry a plurality of bank selection signals to select one of the sub banks for data transmission between the local bit lines and the global bit lines.
Public/Granted literature
- US20150121030A1 HIGH DENSITY MEMORY STRUCTURE Public/Granted day:2015-04-30
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