Invention Grant
- Patent Title: Formation of air-gap spacer in transistor
- Patent Title (中): 在晶体管中形成气隙间隔物
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Application No.: US14190641Application Date: 2014-02-26
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Publication No.: US09305835B2Publication Date: 2016-04-05
- Inventor: Emre Alptekin , Viraj Sardesai , Cung Tran , Reinaldo Vega
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Steven J. Meyers
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/4763 ; H01L21/70 ; H01L21/768 ; H01L21/28 ; H01L21/283

Abstract:
Embodiments of present invention provide a method of forming air spacers in a transistor structure. The method includes forming a gate structure of a transistor on top of a semiconductor substrate; forming a first and a second disposable spacers adjacent to a first and a second sidewall of the gate structure; forming a first and a second conductive studs next to the first and the second disposable spacer; removing the first and second disposable spacers to create empty spaces between the first and second conductive studs and the gate structure; and preserving the empty spaces by forming dielectric plugs at a top of the empty spaces.
Public/Granted literature
- US20150243544A1 FORMATION OF AIR-GAP SPACER IN TRANSISTOR Public/Granted day:2015-08-27
Information query
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