Invention Grant
- Patent Title: BEOL interconnect with carbon nanotubes
- Patent Title (中): BEOL与碳纳米管互连
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Application No.: US13601963Application Date: 2012-08-31
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Publication No.: US09305838B2Publication Date: 2016-04-05
- Inventor: Pravin K. Narwankar , Joe Griffith Cruz , Arvind Sundarrajan , Murali Narasimhan , Subbalakshmi Sreekala , Victor Pushparaj
- Applicant: Pravin K. Narwankar , Joe Griffith Cruz , Arvind Sundarrajan , Murali Narasimhan , Subbalakshmi Sreekala , Victor Pushparaj
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: H01L29/41
- IPC: H01L29/41 ; H01L21/768 ; A61Q9/04 ; H01L23/538 ; A61K8/46 ; A61K8/81 ; B82Y40/00

Abstract:
An integrated circuit with BEOL interconnects may comprise: a substrate including a semiconductor device; a first layer of dielectric over the surface of the substrate, the first layer of dielectric including a filled via for making electrical contact to the semiconductor device; and a second layer of dielectric on the first layer of dielectric, the second layer of dielectric including a trench running perpendicular to the longitudinal axis of the filled via, the trench being filled with an interconnect line, the interconnect line comprising cross-linked carbon nanotubes and being physically and electrically connected to the filled via. Cross-linked CNTs are grown on catalyst particles on the bottom of the trench using growth conditions including a partial pressure of precursor gas greater than the transition partial pressure at which carbon nanotube growth transitions from a parallel carbon nanotube growth mode to a cross-linked carbon nanotube growth mode.
Public/Granted literature
- US20130228933A1 BEOL Interconnect With Carbon Nanotubes Public/Granted day:2013-09-05
Information query
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