Invention Grant
- Patent Title: Intermetallic compound filled vias
- Patent Title (中): 金属间化合物填充的通孔
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Application No.: US14189389Application Date: 2014-02-25
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Publication No.: US09305866B2Publication Date: 2016-04-05
- Inventor: Minhua Lu , Jae-Woong Nah
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Ellenbogen & Kammer, LLP
- Agent Louis J. Percello
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/48 ; H01L21/768 ; H01L23/00 ; H01L23/498 ; H01L21/48
Abstract:
Electronic devices including intermetallic columns within vias are provided. Vias are filled with one or more pastes containing metal particles. Thermal treatment of the pastes within the vias converts the particles within the pastes to one or more intermetallic compounds that do not melt during next level packaging.
Public/Granted literature
- US20150243584A1 INTERMETALLIC COMPOUND FILLED VIAS Public/Granted day:2015-08-27
Information query
IPC分类:
