发明授权
- 专利标题： Power module and method of manufacturing the power module
- 专利标题（中）： 电源模块及其制造方法
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申请号： US14123909申请日： 2012-06-28
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公开(公告)号： US09306020B2公开(公告)日： 2016-04-05
- 发明人: Shinichi Fujino , Hideto Yoshinari , Shiro Yamashita
- 申请人： Shinichi Fujino , Hideto Yoshinari , Shiro Yamashita
- 申请人地址： JP Hitachinaka-shi
- 专利权人： Hitachi Automotive Systems, Ltd.
- 当前专利权人： Hitachi Automotive Systems, Ltd.
- 当前专利权人地址： JP Hitachinaka-shi
- 代理机构： Crowell & Moring LLP
- 优先权： JP2011-144593 20110629
- 国际申请： PCT/JP2012/066571 WO 20120628
- 国际公布： WO2013/002338 WO 20130103
- 主分类号： H01L29/66
- IPC分类号： H01L29/66 ; H01L29/45 ; H01L25/18 ; H01L23/00 ; H01L23/36 ; H01L23/433 ; H01L23/495 ; H01L23/482 ; H01L29/417 ; H01L23/488 ; H01L23/492 ; H01L23/473
摘要：
A power module includes a semiconductor device having at least one electrode surface on each side thereof, a first conductive member connected to the electrode surface provided on one side of the semiconductor device with solder, and a second conductive member connected to the electrode surface provided on the other side of the semiconductor device with solder, with at least one of the electrode surfaces provided on the one side of the semiconductor device being double comb-shaped.