Invention Grant
- Patent Title: Semiconductor power device
- Patent Title (中): 半导体功率器件
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Application No.: US14083551Application Date: 2013-11-19
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Publication No.: US09306045B2Publication Date: 2016-04-05
- Inventor: Wei-Lun Hsu , Chung-Yi Chiu
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, PC
- Agent Justin King
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/739 ; H01L29/08

Abstract:
A semiconductor power device is provided, comprising a substrate of a first conductive type, a buffering layer of a second conductive type formed on the substrate, a voltage supporting layer formed on the buffering layer, and alternating sections of different conductive types formed at the substrate. The voltage supporting layer comprises first semiconductor regions of the first conductive type and second semiconductor regions of the second conductive type, wherein the first semiconductor regions and the second semiconductor regions are alternately arranged. The alternating section and the buffering layer form a segmented structure of alternated conductive types, which is used as an anode of the semiconductor device.
Public/Granted literature
- US20150137176A1 SEMICONDUCTOR POWER DEVICE Public/Granted day:2015-05-21
Information query
IPC分类: