发明授权
- 专利标题: High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
- 专利标题(中): 配有多个双室模块的高通量半导体处理设备
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申请号: US13154271申请日: 2011-06-06
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公开(公告)号: US09312155B2公开(公告)日: 2016-04-12
- 发明人: Yukihiro Mori , Takayuki Yamagishi
- 申请人: Yukihiro Mori , Takayuki Yamagishi
- 申请人地址: JP Tokyo
- 专利权人: ASM Japan K.K.
- 当前专利权人: ASM Japan K.K.
- 当前专利权人地址: JP Tokyo
- 代理机构: Snell & Wilmer LLP
- 主分类号: B05C11/10
- IPC分类号: B05C11/10 ; B32B41/00 ; H01L21/683 ; H01L21/67 ; G05B19/418 ; H01L21/677
摘要:
A wafer-processing apparatus includes: eight or ten reactors with identical capacity for processing wafers on the same plane, constituting four or five discrete units, each unit having two reactors arranged side by side with their fronts aligned in a line; a wafer-handling chamber including two wafer-handling robot arms each having at least two end-effectors; a load lock chamber; and a sequencer for performing, using the two wafer-handling robot arms, steps of unloading/loading processed/unprocessed wafers from/to any one of the units, and steps of unloading/loading processed/unprocessed wafers from/to all the other respective units in sequence while the wafers are in the one of the units.
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