Invention Grant
- Patent Title: Conformal coating including embedded thermal energy absorbing material
- Patent Title (中): 保形涂层包括嵌入式热能吸收材料
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Application No.: US13976438Application Date: 2012-12-11
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Publication No.: US09313875B2Publication Date: 2016-04-12
- Inventor: Jered H. Wikander , Mark MacDonald , Shawn S. McEuen , Harish Jagadish , David Pidwerbecki
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Kacvinsky Daisak Bluni PLLC
- Priority: IN3639/DEL/2011 20111214
- International Application: PCT/US2012/069003 WO 20121211
- International Announcement: WO2013/090286 WO 20130620
- Main IPC: H05K5/00
- IPC: H05K5/00 ; G06F1/16 ; H05K7/00 ; H05K7/20 ; H01S4/00 ; B29C45/14 ; H05K1/02 ; G06F1/20 ; H05K3/00
Abstract:
Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.
Public/Granted literature
- US20140285967A1 CONFORMAL COATING INCLUDING EMBEDDED THERMAL ENERGY ABSORBING MATERIAL Public/Granted day:2014-09-25
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