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公开(公告)号：US09551177B2
公开(公告)日：2017-01-24
申请号：US14141196
申请日：2013-12-26
Applicant: INTEL CORPORATION
Inventor： Krishnakumar Varadarajan , Harish Jagadish , Anand V. Reddy , Madhukar Patil , James Panakkal , Guru Prakash
CPC classification number: E05D11/1007 , G06F1/1679 , G06F1/1681 , Y10T16/54025 , Y10T29/24
Abstract: Techniques related to a hinge in a computing device are described herein. The techniques may include forming a shaft to move rotationally, and forming a sliding component to move translationally as a result of rotational movement of the shaft.
Abstract translation: 本文描述了与计算设备中的铰链相关的技术。 这些技术可以包括形成轴以便旋转地移动，以及形成由于轴的旋转运动而平滑运动的滑动部件。
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公开(公告)号：US11755080B2
公开(公告)日：2023-09-12
申请号：US17560719
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
CPC classification number: G06F1/203 , G06F1/1616 , G06F1/1637 , G06F1/1647 , G06F1/1681 , H04M1/022 , H05K7/2039 , G06F3/041 , G06F2200/203 , H04M1/0216 , H04M2250/16
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：US20220113759A1
公开(公告)日：2022-04-14
申请号：US17560719
申请日：2021-12-23
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：US09313875B2
公开(公告)日：2016-04-12
申请号：US13976438
申请日：2012-12-11
Applicant: INTEL CORPORATION
Inventor： Jered H. Wikander , Mark MacDonald , Shawn S. McEuen , Harish Jagadish , David Pidwerbecki
IPC: H05K5/00 , G06F1/16 , H05K7/00 , H05K7/20 , H01S4/00 , B29C45/14 , H05K1/02 , G06F1/20 , H05K3/00
CPC classification number: H05K1/0209 , G06F1/1656 , G06F1/203 , H05K3/00 , H05K3/284 , H05K7/2039
Abstract: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.
Abstract translation: 公开了用于围绕电源电路，电气部件或用于计算设备的显示器的至少部分模制的保形涂层的示例。 保形涂层包括嵌入式微胶囊化热能储存材料，以吸收由电气部件产生的热量。
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公开(公告)号：USD1023975S1
公开(公告)日：2024-04-23
申请号：US29798996
申请日：2021-07-12
Applicant: Intel Corporation
Designer： Samantha Rao , Harish Jagadish , Arvind S
Abstract: FIG. 1 is a right, top perspective view of a busbar.
FIG. 2 is a front view thereof.
FIG. 3 is a rear view thereof.
FIG. 4 is a right side view thereof.
FIG. 5 is a left side view thereof; and,
FIG. 6 is a top view thereof.
The features shown in broken lines form no part of the claimed design.-
Patent Agency Ranking
公开(公告)号：US10712779B2
公开(公告)日：2020-07-14
申请号：US15529050
申请日：2015-12-07
Applicant: INTEL CORPORATION
Inventor： Anand V. Reddy , Guru Prakash , Harish Jagadish , Arvind Sundaram
IPC: G06F1/16 , H05K5/00 , H05K7/00 , G06F1/3212
Abstract: Embodiments are generally directed to a unified chassis construction for an all in one computer. An embodiment of a computer system includes a computer sub-system to provide computer operation; a display sub-system to provide display operation; a unified plate, components installed in the unified plate including at least one or more computer sub-system components and one or more display sub-system components; and a display screen coupled with the unified plate.
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公开(公告)号：USD1024974S1
公开(公告)日：2024-04-30
申请号：US29793027
申请日：2021-07-12
Applicant: Intel Corporation
Designer： Samantha Rao , Harish Jagadish , Arvind S
Abstract: FIG. 1 is a right, top perspective view of a busbar.
FIG. 2 is a front view thereof.
FIG. 3 is a rear view thereof.
FIG. 4 is a right side view thereof.
FIG. 5 is a left side view thereof.
FIG. 6 is a top view thereof
FIG. 7 is a bottom view thereof.
FIG. 8 is a right, bottom perspective view thereof; and,
FIG. 9 is an exploded view of the busbar of FIG. 1.
The features shown in broken lines form no part of the claimed design.-
公开(公告)号：US11649993B2
公开(公告)日：2023-05-16
申请号：US16457229
申请日：2019-06-28
Applicant: INTEL CORPORATION
Inventor： Gavin Sung , Gerry Juan , Harish Jagadish , Ivan By Wang , Jason Y. Jiang , Sammi Wy Liu , Tim Liu , Jeff Ku
Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.
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公开(公告)号：US11231757B2
公开(公告)日：2022-01-25
申请号：US16052590
申请日：2018-08-01
Applicant: Intel Corporation
Inventor： Prakash Kurma Raju , Babu Triplicane Gopikrishnan , Bijendra Singh , Prasanna Pichumani , Raghavendra Doddi , Harish Jagadish , Gopinath Kandasamy , David Pidwerbecki
Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
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公开(公告)号：USD924810S1
公开(公告)日：2021-07-13
申请号：US29675741
申请日：2019-01-04
Applicant: Intel Corporation
Designer： Samantha Rao , Harish Jagadish , Arvind S
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