Invention Grant
- Patent Title: CMP pad conditioner, and method for producing the CMP pad conditioner
- Patent Title (中): CMP垫调节剂及其制造方法
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Application No.: US14117936Application Date: 2012-05-15
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Publication No.: US09314901B2Publication Date: 2016-04-19
- Inventor: Seh Kwang Lee , Youn Chul Kim , Joo Han Lee , Jae Kwang Choi , Jae Phil Boo
- Applicant: Seh Kwang Lee , Youn Chul Kim , Joo Han Lee , Jae Kwang Choi , Jae Phil Boo
- Applicant Address: KR Osan-Si
- Assignee: EHWA DIAMOND INDUSTRIAL CO., LTD.
- Current Assignee: EHWA DIAMOND INDUSTRIAL CO., LTD.
- Current Assignee Address: KR Osan-Si
- Agency: Stein IP, LLC
- Priority: KR10-2011-0046305 20110517
- International Application: PCT/KR2012/003788 WO 20120515
- International Announcement: WO2012/157936 WO 20121122
- Main IPC: B24B53/017
- IPC: B24B53/017 ; B24B53/02 ; B24D18/00

Abstract:
This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.
Public/Granted literature
- US20140094101A1 CMP PAD CONDITIONER, AND METHOD FOR PRODUCING THE CMP PAD CONDITIONER Public/Granted day:2014-04-03
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