发明授权
- 专利标题: Local cooling unit and cooling system
- 专利标题(中): 局部冷却单元和冷却系统
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申请号: US13101202申请日: 2011-05-05
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公开(公告)号: US09317080B2公开(公告)日: 2016-04-19
- 发明人: Teruo Mikami , Tomohiro Yoshida , Masakatsu Senda , Ryoji Shimokawa , Yasuhiro Kashirajima
- 申请人: Teruo Mikami , Tomohiro Yoshida , Masakatsu Senda , Ryoji Shimokawa , Yasuhiro Kashirajima
- 申请人地址: JP Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Jones Robb, PLLC
- 优先权: JP2010-109700 20100511
- 主分类号: F25D23/12
- IPC分类号: F25D23/12 ; F25D21/06 ; G06F1/20 ; H05K7/20
摘要:
The local cooling unit according to an aspect of the present invention includes a housing having a cavity formed in the housing, an air inlet port which is provided in a bottom surface of the housing and which takes in exhaust heat air from the electronic device, an evaporator which is provided in the housing and which evaporates a refrigerant by heat exchange with air sucked in from the air inlet port to cool the air, the refrigerant passing through an inside of the evaporator, an air outlet port which is provided in a side surface of the housing and which exhausts the air cooled by the evaporator, and a fan which is provided on a side of the air inlet port or a side of the air outlet port of the housing and which moves the air from the air inlet port to the air outlet port.
公开/授权文献
- US20110279976A1 LOCAL COOLING UNIT AND COOLING SYSTEM 公开/授权日:2011-11-17